this post was submitted on 08 Jul 2023
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The enclosure will definitely retain heat from the bed. Is the filament spool also inside the enclosure with the printer? If so it's probably getting pre-warmed, making it softer.
This isn't a bad thing, but you should probably re-do your temperature calibration tests for your filament inside the enclosure.
That's a really good point -- you can model a process as an RC where there's a resistance and a capacitance. A major change to a process such as adding an enclosure that retains heat and reduces draft would change the process RC, so your PID settings would need to be different for optimal control.
Yes, if you change the conditions under which a calibration was performed, the calibration is no longer valid and needs to be repeated for the new conditions.
Hotend and and fan pid shouldn't be too out of whack . But needed fanspeeds and bridging would change depending on ambient temps.